Electronic components
often have specific requirements for their packaging.
This could include the use of anti-static or static
dissipative materials.
Situated at the heart of Scotland’s Silicon
Glen, Glendale has had many years of expertise
in supplying packs for electronic components as
well as injection moulding the specialist components
themselves.
From computer memory chip packaging to injection
moulded connectors for the power supply industry
you will find something in Glendale’s experience
to be of interest.
Materials
used: conductive, anti-static and static
dissipative materials
